Model | - Disco, 2017 - model DAD323 |
---|---|
Operating time | 09:00 ~ 18:00 |
Location | IBS HQ C169 clean room 1000 (deposition room) |
inquiry |
1. Equipment name : Dicing saw (웨이퍼 절단기)
2. Manufacture and Model
- Disco, 2017
- model DAD323
3. Purpose : This equipment is used to measurement for low temperature detectors. It is an automatic dicing saw for ø6-inch wafers with small footprint.
4. Specification and performance
- Automatic dicing saw for ø 6-inch wafers
150 mm square workpiece support can be added via a user-specified specification.
- Offering the world’s smallest space-saving footprint
W: 490 mm
D: 870 mm
H: 1,600 mm
This advantage is especially apparent when multiple units are used in parallel (improved productivity per unit area).
- Improved throughput :
Improved speed for the X, Y, and Z-axis.
* Maximum speed of the X-axis improved to 700 m/s (Increased by about 1.4x compared to the existing DAD322).
Incorporation of a high performance processor
Screen transition time and software operation speed have been greatly improved.
- High torque 2.0 kW spindle installed
Supports the processing of difficult-to-cut materials including glass and ceramics
A high rotation speed 1.8 kW spindle is also available as an option (max rotation speed: 60,000 min-1).
- Further evolution for improved user friendliness
Increased operation monitor size (Current: 10.4 inches →15 inches) for improved visual recognition and an increase in the amount of displayable information.
5. Location and Picture :
- IBS head quarter, C169 clean room 1000 (deposition room)