Center for Multidimensional Carbon Materials

Interface‐Driven Partial Dislocation Formation in 2D Heterostructures

Jung Hwa Kim, Se-Yang, Kim, YeonChoo Cho, Hyo Ju Park, Hyeong-Jin Shin, Soon-Yong Kwon, Zonghoon Lee [Advanced Materials 31, 15, 1807486(2019)]

Fcc Versus Non-fcc Structural Isomerism of Gold Nanoparticles with Kernel Atom Packing Dependent Photoluminescence

Shengli Zhaung, Lingwen Liao, Jinyun Yuan, Nan Xia, Yan Zhao, Chengming Wang, Zibao Gan, Nan Yan, Lizahong He, Jin Li, Haiten Deng, Zhaoyong Guan, Jinlong Yang, Zhikun Wu [Angewandte Chemie International Edition 58, 14, 4414-4414(2019)]

High Throughput Scanning μLEED Imaging of Surface Structural Heterogeneity: Defective Graphene on Cu(111)

K.L.W.Lau, K.M.Yu, D. Luo, R.S. Ruoff, M.S.Altman [Ultramicroscopy 200, 67-72(2019)]

Giant Thermal Conductivity in Diamane and the Influence of Horizontal Reflection Symmetry on Phonon Scattering

Liyan Zhu, Wu Li, Feng Ding [Nanoscale 10, 4248-4257(2019)]

Crystalline Beryllium Oixde on Si(100) Deposited Using E-beam Evaporator and Thermal Oxidation

Seonno Yoon, Seung Min Lee, Jung Hwan Yum, Christopher W Bielawski, Hi-Deok Lee, Jungwoo Oh [Applied Surface Science 479, 803-809(2019)]

Planar and van der Waals Heterostructures for Vertical Tunnelling Single Electron Transistors

Gwangwoo Kim, Sung-Soo Kim, Jonghyuck Jeon, Seong In Yoon, Seokmo Hong, Young Jin Cho, Abhishek Misra, Servet Ozdemir, Jun Yin, Davit Ghazaryan, Mathew Holwill, Artem Mishchenko, Daria V. Andreeva, Yong-Jin Kim, Hu Young Jeong, A-Rang Jang, Hyung-Jong Chu [Nature Communication 10, 230(2019)(2019)]

Grain Boundaries in Chemical Vapor Deposited Atomically Thin Hexagonal Boron Nitride

Xibiao Ren, Jichen Dong, Peng Yang, Jidong Li, Guangyuan Lu, Tianru Wu, Haomin Wang, Wanlin Guo, Ze Zhang, Feng Ding, Chuanhong Jin [Physical Review Materials 3, 014004(2019)]

A "turn-on" Fluorescent Probe for the Detection of Permanganate in Aueous Media

Genggongwo Shi, Mushtag Ahmed Shanhid, Muhammad Yousuf, Farzana Mahmood, Lubna Rasheed, Christopher W. Bielawski, Kwang S. Kim [Chemical Communications 55, 1470-1473(2019)]