Center for Integrated Nanostructure Physics

Evaporation of the material and deposition system that simultaneously operate from 2 E-beam sources.
 

General Information
 
■ System Performance
1. Film thickness uniformity < ±5% in 4inch area
2. E-beam source : 2cc / 4pocket , 3kW (2set)
3. Resitance heater : 2cc / Pocket type
4. Heating temp. on substrate : Max. 650℃
5. Heating uniformity : < ±5% in 4inch area

■ System Specification
=== Vacuum chamber ===
1. Material : Electro-polished 304 stainless steel
2. Chamber shape : Welded front door box type
3. Chamber demension : 470 (width) x 440(depth) x 550 (height)
4. Top plate : Substrate module mount
5. Bottom plate: Thermal & E-beam source source module mount
6. Load lock assemblies
- Rail type single substrate transfer
- High vacuum pumping & gauge Rotary pump common use

=== Vacuum Control ===
1. Rotary vane pump : 500 L/min or more
2. Cryo pump : 1,500 L/sec for N2
3. Pumping line vacuum gauge : Convection gauge
4. Chamber vacuum gauge: Cold cathode ion gauge sensor high vacuum

=== Substrate Module ===
1. Sample Size : 4" single wafer
2. Heater :
- Water cooling type mold heater
- Heater Max Temp : 650 ℃
- Thermocouple type : k-type
- Programable temperature controller
3. Rotator :
-Rotation speed (Max 20rpm)
- Water cooled vacuum seal feedthrough
4. Thickness control : 4 ch control (thickness resolution : 0.1Å)
5. Co-evap monitor sensor : 3 ch
6. Load lock assemblies

=== Deposition Module ===
1. E-beam & Power supply: 2cc/4pocket & 3kW power (2set)
2. Resistance heater source & Power supply: 2cc Pocket type (1set)

=== Desktop Frame ===
1. Size: 1,300 (width) x 800 (depth) x 1,800 (height)
2. Structure
- Non-Electrostatic painted iron frame
- Easily movable foot master
3. Installation
- Vacuum Chamber /Pumping units
- Touch PC
- PLC & Electric board
- Main Power / Emergency switch

=== System Control ===
1. Operation: Control by Touch PC
2. Safety: Alarm & Interlock