To explore new physics phenomena of low dimensional materials
with a special emphasis on two-dimensional layered structures
Model | Customed |
---|---|
Operating time |
SUN(00:00~24:00) MON(00:00~24:00) TUE(00:00~24:00) WED(00:00~24:00) THU(00:00~24:00) FRI(00:00~24:00) SAT(00:00~24:00) |
Location | 86391 |
inquiry |
Sumin Kim 010-5119-4578 carem0613@gmail.com |
Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by sputtering.
This involves ejecting material from a "target", a material source onto a "substrate" such as a silicon wafer.
System dimesion : 1800(L)x1500(D)x1500(H)mm included control rack
Substrate specification
1) Sample holder material : STS304 or Graphite, etc
2) Deposition sample size : 1 inch x 1 inch
Sputtering method : down type sputter
Base pressure in main chamber : ≤ 8 x 10^(-8) Torr
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