Center for Relativistic Laser Science

1. Equipment name : Dicing saw (웨이퍼 절단기)

2. Manufacture and Model

- Disco, 2017

- model DAD323

3. Purpose : This equipment is used to measurement for low temperature detectors. It is an automatic dicing saw for ø6-inch wafers with small footprint.

4. Specification and performance

- Automatic dicing saw for ø 6-inch wafers

150 mm square workpiece support can be added via a user-specified specification.

- Offering the world’s smallest space-saving footprint

W: 490 mm

D: 870 mm

H: 1,600 mm

This advantage is especially apparent when multiple units are used in parallel (improved productivity per unit area).

- Improved throughput :

Improved speed for the X, Y, and Z-axis.

* Maximum speed of the X-axis improved to 700 m/s (Increased by about 1.4x compared to the existing DAD322).

Incorporation of a high performance processor

Screen transition time and software operation speed have been greatly improved.

- High torque 2.0 kW spindle installed

Supports the processing of difficult-to-cut materials including glass and ceramics

A high rotation speed 1.8 kW spindle is also available as an option (max rotation speed: 60,000 min-1).

- Further evolution for improved user friendliness

Increased operation monitor size (Current: 10.4 inches →15 inches) for improved visual recognition and an increase in the amount of displayable information.

5. Location and Picture :

- IBS head quarter, C169 clean room 1000 (deposition room)